BERGQUIST贝格斯替代材料SIL PAD 2000HGZ-2000SP间隙填充导热材料HGZ-2000SP可供规格：厚度(Thickness)：0.25mm 0.38mm 0.45mm 0[详情]

贝格斯导热片SIL PAD TSP1600S替代品HGZ-900SPHGZ-900SP导热间隙填充材料HGZ-900SP可供规格：厚度(Thickness)：0.2mm 0.23mm 0.2[详情]

贝格斯SILPAD400导热硅胶片替代品HGZ-400SPHGZ-400SP可供规格：厚度：0.2mm 0.23mm 0.28mm 0.3mm 0.35mm 0.4mm 0.45mm 0.5mm卷材[详情]